Diamond and SiC Composite Material
From the deep see to the far universe and down to the earth
Applications:
Subsea exploration; Ocean biology Aerospace Astronautical Medical Semiconductor
Lab chemistry and other harsh environment industrial
Specifications
Material | Diamond Size | Diamond Content | Thermal Conductivity |
µm | vol.% | W/m. K | |
DiaSiC400 | 50 | 42 | 400±5 |
DiaSiC500 | 100 | 58 | 500±5 |
Advantages:
Cost effective solutions for the most demanding working environment
Flexible shapes and complex machining structures acceptable
Excellent wear and corrosion resistance
