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January12, 2026
AI Chips Shifting from Round to Rectangular
As the demand for AI and highperformance computing HPC accelerates the semiconductor packaging industry is undergoing a major transformation moving from round silicon ...
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AI Chips Shifting from Round to Rectangular
January12, 2026
Ultra thin Extra Large-Sized, Super High Thermal Conductivity Diamond/Copper Composites
Ultra thin Extra LargeSized Super High Thermal Conductivity DiamondCopper CompositesA highthermalconductivity diamondcopper diamondCu composite was fabricated by Diasem...
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Ultra thin Extra Large-Sized, Super High Thermal Conductivity Diamond/Copper Composites
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