Aluminum Nitride (AIN) Ceramic Heater Block Assy for semiconductor wafer bonding hetereo integration
Rapid heating and rapid cooling
Application:
Flip chip bonding
TSV ( Through Silicon Via)
ACF(Anisotropic conductive film) Thermal Compression
Chip on Flex (COF)
Chip on Glass( COG)
Flex on Glass( FOG)
Flex on Flex( FOF)
Replace modles:
ACH12
ACH16
ACH22
JSH22K
JSH32L
JSH52K
JKH16
JKH16
JKH6014
JKH6070
Customized modification ,revolutionary new design available
