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April26, 2026
High-Performance Diamond Optical Windows for Extreme Photonic Applications
In advanced optical systemssuch as EUV lithography highpower laser windows wafer laser annealing systems and microwave windows in gyrotrons for controlled nuclear fusio...
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High-Performance Diamond Optical Windows for Extreme Photonic Applications
January12, 2026
AI Chips Shifting from Round to Rectangular
As the demand for AI and highperformance computing HPC accelerates the semiconductor packaging industry is undergoing a major transformation moving from round silicon ...
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AI Chips Shifting from Round to Rectangular
January12, 2026
Ultra thin Extra Large-Sized, Super High Thermal Conductivity Diamond/Copper Composites
Ultra thin Extra LargeSized Super High Thermal Conductivity DiamondCopper CompositesA highthermalconductivity diamondcopper diamondCu composite was fabricated by Diasem...
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Ultra thin Extra Large-Sized, Super High Thermal Conductivity Diamond/Copper Composites
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